Note: The job is a remote job and is open to candidates in USA. Nokia is a global leader in connectivity for the AI era. They are seeking a highly experienced Staff High-Power Laser Assembly Development Engineer to lead the development, optimization, and industrialization of advanced assembly processes for high-power semiconductor laser products.
Responsibilities
- Lead the development of assembly designs and manufacturing processes for high-power InP and GaAs laser products
- Drive process innovation and optimization to achieve performance, reliability, cost, and manufacturability targets
- Analyze and optimize interactions between assembly materials, die attach processes, mechanical stress, thermal performance, and laser operating characteristics
- Develop, evaluate, and implement assembly tooling, automation solutions, and characterization methodologies
- Perform and interpret die attach stress simulations and correlate results with product performance and reliability data
- Lead failure analysis investigations and implement corrective actions to improve product robustness and yield
- Support product qualification activities and establish manufacturing quality standards, process controls, and validation methods
- Drive the transition of new products from development into volume manufacturing
- Collaborate with cross-functional engineering teams to address technical challenges and accelerate product development
- Mentor engineers and contribute to the growth of assembly and packaging expertise within the organization
Skills
- Advanced degree (MS or PhD preferred) in Mechanical Engineering, Materials Engineering, Physics, Photonics, or a related discipline
- 10+ years of industry experience in semiconductor laser packaging, assembly development, or a closely related field
- Proven expertise in assembly design and process development for high-power InP and/or GaAs laser products
- Deep understanding of material interactions, die attach processes, mechanical stress mechanisms, thermal management, stability, and their impact on laser performance
- Hands-on experience with assembly tooling, automation systems, characterization techniques, manufacturing process development, and failure analysis methodologies
- Experience performing or interpreting die attach stress simulations and related modeling activities
- Demonstrated track record of successful product development leading to qualification, volume production, manufacturing scale-up, and automation
- Strong knowledge of manufacturing quality systems, process controls, and reliability standards
- Experience supporting high-volume optical component manufacturing environments
- Knowledge of semiconductor packaging reliability testing and qualification methodologies
- Familiarity with statistical analysis and process improvement methodologies
- Experience working in multidisciplinary photonics or optical networking organizations
Benefits
- Corporate Retirement Savings Plan
- Health and dental benefits
- Short-term disability, and long-term disability
- Life insurance, and AD&D – Company paid 2x base pay
- Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
- Paid time off for holidays and Vacation
- Employee Stock Purchase Plan
- Tuition Assistance Plan
- Adoption assistance
- Employee Assistance Program/Work Life Resource Program
Company Overview
Company H1B Sponsorship