Note: The job is a remote job and is open to candidates in USA. TYLsemi is a company focused on building chiplet infrastructure IP for the AI infrastructure market. The XPU Business Development Leader will own customer and ecosystem development, engaging with key accounts in the AI infrastructure market and translating customer requirements into product specifications for R&D.
Responsibilities
- Identify, qualify, and develop strategic accounts — hyperscalers, AI compute companies, and infrastructure semiconductor customers — from first contact through proposals and commercial agreement
- Engage customer architecture, platform, and procurement teams at the technical level; translate AI chip and chiplet platform requirements into actionable product specs for R&D
- Own the ecosystem partner map — IP vendors, OSATs, packaging partners, and foundry ecosystem programs; establish and maintain working relationships that support product and tape-out execution
- Drive participation in industry standards bodies and chiplet consortia (UCIe Consortium, PCI-SIG, CXL Consortium, OCP, IEEE, JEDEC etc.) to build visibility and influence roadmap alignment
- Develop and manage NDA pipeline, customer evaluation programs, and early-access engagements in coordination with engineering
- Produce and maintain account plans, pipeline tracking, and BD status reporting for leadership
- Represent TylSemi at industry events, customer briefings, and technical forums
Skills
- 10+ years in business development, FAE, or customer/product management roles in semiconductors, with direct exposure to advanced AI chips, accelerators, or chiplet-based silicon
- Established relationships across hyperscaler silicon teams, AI chip startups, or custom ASIC customers; able to open doors at the architecture level, not just procurement
- Experience working the ecosystem side: IP vendors, foundry BD programs, OSAT, or packaging partners
- Track record of moving deals from first contact to signed agreement in a technical, long-cycle semiconductor sales environment
- Comfortable operating without a large support structure — this role owns its own pipeline, materials, and follow-through
- US-based; ability to travel for customer and industry engagements
- FAE or CPM background strongly preferred — technical depth to engage R&D and platform teams credibly on chiplet integration, UCIe, PCIe, or power delivery topics
Company Overview