Note: The job is a remote job and is open to candidates in USA. NVIDIA is a leader in GPU and SOC technology, seeking a Senior Package Layout Engineer to contribute to innovative solutions across various sectors. This role involves collaboration with design teams to create detailed layouts for IC substrates, addressing manufacturing and electrical design challenges.
Responsibilities
- As part of a Layout team, you will collaborate to implement high speed/density ASIC packages
- Perform substrate breakout patterns for ASIC packages
- Optimize package pinout incorporating system level trade-offs of pins assignment
- Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite
- Propose layout design trade-offs to the Technical Package Lead for resolution and implementation
- Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance
- Develop symbols and CAD library databases using Cadence APD design tools
- Develop methodologies to improve layout productivity
Skills
- Hold a B.S. Electrical Engineering or equivalent experience
- 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology
- Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
- Solid understanding of high-speed design signal integrity practices
- Experience with HDI designs is a plus
- Proven experience in substrate layout of wire bond and flip chip packages, preferred
- Experience with Virtuoso and Calibre is a plus
- Experience using Valor is helpful
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