Note: The job is a remote job and is open to candidates in USA. ProFound People is changing the landscape of semiconductor manufacturing with innovative technology. They are seeking a Substrate IC Package Engineer to develop cutting-edge precision manufacturing processes for next-generation micro-scale technologies, focusing on high-performance chip-to-chip integration solutions.
Responsibilities
- IC Package Substrate Design for high-performance multi-layer interposers
- Shaping next-generation packaging architectures, including high-performance chip-to-chip integration solutions
- Empowering in-house design of advanced substrate IC packages
Skills
- Multiple years of experience in substrate IC package design for high-performance processors or accelerators
- Advanced proficiency in Allegro Package Designer (constraint management, routing, and design verification)
- Extensive experience designing large-format substrate packages (>50mm) with complex, high-density layouts
- Strong understanding of SI/PI principles and their application to package-level design
- Deep expertise in high-speed signal design, including mitigation of crosstalk, reflections, and impedance mismatches
Benefits
- Fully remote opportunity (anywhere in the world)
Company Overview