Note: The job is a remote job and is open to candidates in USA. NVIDIA is a technology company developing AI and accelerated computing technologies. The Senior Packaging Technical Engineer will define and implement chip pad rings, substrate interconnect schemes, package layouts, and electrical package designs while collaborating with cross-functional engineering teams.
Responsibilities
- Your responsibilities include defining and implementing the chip pad ring, substrate interconnect scheme, and lead the package layout design process
- We collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers
- Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package!
- Communicate effectively with various teams throughout the company
Skills
- BSEE or equivalent experience
- Minimum of 8+ years in board/system design
- Good understanding of transmission line theory, power delivery and signal integrity is desired
- Hardworking and able to work with a minimum of supervision
- You seek to solve complex technical problems
- Experience with package design is preferred
- It is preferred to have programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCEL familiarity are useful and a plus
Benefits
- A comprehensive benefits package
- Equity
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