Note: The job is a remote job and is open to candidates in USA. Positron AI develops custom hardware systems for AI inference. The Senior Mechanical Engineer will own mechanical, thermal-mechanical, and enclosure design for AI inference platforms, guiding designs from concept through volume production and working with manufacturing partners.
Responsibilities
- Own the mechanical design of enclosures, chassis, and carrier-board mechanical integration for rack-mount (1U/2U) inference systems—including spatial studies, conceptual and detailed design, solid models, drawings, BOMs, and tolerance stack-up analysis
- Lead thermal-mechanical and structural design and simulation for high-TDP ASIC platforms—heatsinks, cold plates, retention hardware, airflow, and shock/vibration—partnering with electrical and thermal teams to meet air- and liquid-cooled performance targets
- Act as the primary mechanical lead and Positron representative for contract manufacturers, ODMs, and custom-part fabricators (sheet metal, injection molding, die casting, MIM, cable) through EVT, DVT, pilot, and production ramp
- Lead detailed DFM/DFA reviews—tolerances, assembly sequence, poka-yoke, part reduction and standardization, and DFMEA—to reduce unit cost and improve design robustness
- Develop and qualify custom electromechanical fixtures supporting assembly and test, and own product packaging design, transit qualification, and implementation
- Own mechanical test-plan creation (structural, thermal, environmental), support EMC/EMI shielding and regulatory needs, and manage the mechanical risk register, ECOs, and technical escalations to keep programs on schedule for pilot and manufacturing ramps
Skills
- BS/MS in Mechanical Engineering and 7+ years designing electromechanical and enclosure hardware for high-performance electronic systems, spanning the full NPI lifecycle from concept through volume production
- Proven expertise in 3D CAD (SolidWorks and/or Creo), detailed drawings and GD&T, tolerance stack-up analysis, and structural/thermal simulation (e.g., SolidWorks Simulation/Flow, Ansys)
- Experience with rack-mount or high-density electronic packaging, and direct experience selecting, qualifying, and managing custom-part suppliers and contract manufacturers—including global partners—through EVT/DVT/pilot phases
- Demonstrated track record applying DFM/DFA and FMEA to drive cost, quality, and manufacturability in high-volume or high-complexity production environments
- Strong ability to write clear mechanical specifications and communicate trade-offs across electrical, thermal, ASIC, firmware, and operations teams
- Background in mechanical and thermal design for AI/ML accelerators, servers, or other high-power data center hardware
- Experience correlating CFD and thermal-mechanical simulations to real-world air- or liquid-cooled performance (heatsinks, cold plates, manifolds)
- Experience driving hardware through EMC/EMI shielding, environmental qualification (shock, vibration, thermal), and packaging/transit testing; familiarity with FCC/CE and RoHS/REACH
- Certifications such as Certified SolidWorks Professional, Ansys, DFMA, or packaging qualification (ISTA); relevant patents; and business/finance acumen (e.g., an MBA) connecting design decisions to cost and profitability
Benefits
- Equity
- Comprehensive benefits
- Flexible, supportive environment with room for technical growth and innovation
Company Overview
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