The ideal candidate should have strong relevant and recent technical and hands-on background
and be able is hit the ground running as an individual contributor
Contribute to, or lead, PCB and package substrate layout development for leading-edge optical communication products.
Ensure compliance with IPC standards, company design practices, and fabrication capabilities.
Collaborate with electrical, mechanical, thermal, signal-integrity, power-integrity, and manufacturing teams.
Work with PCB fabricators, and substrate vendors to close DFMs.
Minimum Requirements
Bachelor’s degree or equivalent certifications with a minimum of 10+ years of relevant industry experience in PCB board and/or package substrate layout engineering.
Expert-level proficiency with Cadence Allegro PCB design tools
Strong demonstrated working experience of complex high-density, high-speed PCB and substrate designs using advanced HDI, stacked micro-via, sequential lamination, and fine-pitch BGA technologies.
Hands-on experience with complex multilayer high-density organic substrates, fine-pitch BGAs, and advanced component packages.
Working understanding of transmission line layout geometries and rules (micro strip, strip line, CPW, etc.)
Demonstrated experience in layout of compact low voltage and high current multiphase DC-DC power converters for state-of-the-art processors and GPUs
Strong understanding of PCB fabrication, assembly processes, DFM, and manufacturing tolerances.
Demonstrated success delivering high-volume, high-reliability communication products under aggressive schedules.
Highly Desired Skills
Demonstrated experience with mSAP PCB layout design
Demonstrated experience with layout design of state of art optical pluggable products (CFP2, QSFP-DD, OSFP)
Proficiency in Cadence SiP tools and Substrate layout techniques
Proficiency in layout of designs with Wire Bond components
Strong understanding of PCB fabrication and assembly processes
Strong knowledge of relevant industry standards (IPC Class 2/3, JEDEC, etc.)